Our product failure analysis has two main purposes:

1.Utilize our professional knowledge and analytical capabilities to develop new products and technologies

2. Preliminary evidence collection analysis of obstacles in continuous quality improvement work and issues reported by customers

Combining the rich experience of the laboratory team, industry standard technology, and internally developed tools, product analysts can identify sub micron level defects from billions of transistors on chip ICs. This approach helps to accurately understand the root cause of faults, quickly take corrective measures, and prevent similar problems from occurring.

Product Analysis Process

Step 1- Reproduce the fault in a laboratory environment

Product analysts will use evaluation boards, digital testers and other tools in this Committed step. Special care was taken during this process, such as ESD protection, to ensure that no new defects occurred.

Step 2- Packaging Analysis

Using packaging analysis tools and techniques (such as optical inspection, scanning acoustic microscopy, X-ray), first determine whether there are physical defects in the IC packaging around the chip. If defects are found in the packaging, we will explore between the packaging layers to accurately locate the component that caused the fault.

Step 3- Defect Space Localization

If there are no defects in the packaging, we remove the device packaging and expose the silicon chip. Localization techniques such as light emission microscopy, thermal detection technology, and diagnostic fault simulation are used to narrow the range of crystal tube sets that may have defects.

Step 4- Electrical Analysis

After identifying the problem area, advanced analysis techniques are used to identify individual transistors or components that may cause failure modes. If it is determined that the defect area is on the device packaging, the packaging analyst will explore between the packaging layers to further identify the component causing the failure mode.

Step 5- Physical Analysis

We will identify physical defects related to the electrical characteristics of faulty components. This can be achieved by observing each packaging layer under an electron microscope, and if the defect is between the layers, it can be achieved by observing the cross-section.

Step 6- Record the analysis results

We will use the results of electrical and physical analysis to identify the fault mechanism and clarify the cause of the fault. Then record the root cause of the fault and complete the product analysis steps. The relevant team will receive the analysis report and immediately take corrective measures.