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From
2026-08-12

From Electricity to Light, We Redefine "Driving"

Six months ago, when CPO was still on the eve of mass production at scale, we did one thing: we announced our full scale entry into CPO. Half a year later, NVIDIA's Spectrum X CPO switches have started shipping to partners, and Broadcom's 51.2T Bailly CPO switches are maintaining small volume production. CPO has officially moved from proof of concept into the commercial mass production phase. Looking back, that decision was not impulsive. It was not only a strategic choice to align with the generational shift in AI computing infrastructure, but also a critical leap that transforms our deep expertise in display drivers and power management into a core competitive edge in next generation optoelectronic integration. As a company that started with display drivers and power management, our move into CPO is by no means blind diversification; it is grounded in the commonality of underlying technologies: Core Positioning in Power Management: CPO modules integrate optical engines and switching chips with high density, imposing extreme demands on local power supply stability, transient response, and energy efficiency. Our deep accumulation in power management ICs (PMICs) is now being transformed into high density power modules and laser driver chips (LDDs) for CPO optical engines, delivering customized, high precision, low noise power solutions. Synergy of Precision Driving: Our accumulated expertise in precision signal control and packaging processes from display drivers aligns exceptionally well with the precision driving requirements for lasers and modulators in CPO optical engines. This capability is now extending to critical components on the receiving end, such as trans impedance amplifiers (TIAs) and optical modulator driver chips, covering the entire optical signal transmission and reception chain. Embracing Next Generation Technology Evolution: In addition to the mainstream silicon photonics route, we are also actively evaluating emerging technology paths such as Micro LED optical communication. These new technologies pose entirely fresh demands on driving and power, which are precisely the ideal battleground for us to leverage our dual genetic strengths in display drivers and power management. The year 2026 marks the first year of CPO mass production and also our starting year on the optoelectronic integration track. Leveraging our core technological accumulations in Micro LED device driving, optoelectronic calibration, and mass transfer defect compensation, we are extending our dual genetic advantages in display drivers and power management into the field of Micro LED high speed optical interconnects for AI data centers. To date, the company has accumulated over 70 patents, shipped more than 200 million chips in total, and served over 100 clients worldwide. Behind these numbers lies our complete capability loop from R&D to mass production, from validation to delivery, in display drivers and power management. It is precisely this capability that emboldened us to make the strategic decision to fully enter CPO when it was still on the eve of large scale mass production. Looking ahead, we will continue to uphold our core principle of "verifiable, mass producible, and deliverable," striving for excellence in our foundational businesses of power and driving. We will keep increasing R&D investment, collaborate with upstream and downstream partners across the industrial chain, and jointly build a prosperous and healthy semiconductor ecosystem, contributing unique value to the CPO ecosystem. From screens to optical engines, from Micro LED to CPO—we are already on board the vast ocean of optoelectronic integration.   Media Contact: Tel: 0755-26671807 Sales Email: sales@erised-semi.com Website: www.erised-semi.com    
From
2026-08-05

From Micro LED to CPO: Erised Semiconductor Builds a Next Generation Key Platform for Optoelectronic Integration

Targeting the 800G/1.6T upgrade wave, accelerating the deployment of optical interconnects in AI computing centers with "verifiable, manufacturable, and deliverable" solutions. Erised Semiconductor today announced that it will officially enter the CPO (Co Packaged Optics) field, leveraging its existing Micro LED technology platform and mass production experience. The company aims to build a next generation optoelectronic integration platform for AI computing centers, data centers, and high speed switching architectures, helping the industry address one of the most critical system bottlenecks in the global AI infrastructure competition – enabling high efficiency transmission and scalable interconnection of massive data while power consumption and thermal dissipation pressures continue to rise. Figure 1: Architecture schematic diagram   Three Highlights: Defining the Next Generation Interconnect Standard Aligned with the 800G/1.6T upgrade window: Responding to the bandwidth multiplication and interconnection energy pressures in AI data centers, optical interconnect has become a mandatory requirement for next generation platforms. Direct transferability of Micro LED manufacturable system engineering capabilities: High density I/O, package integration, thermal management, process window control, reliability verification, and test systems match the core challenges of CPO. Deep international collaborative R&D accelerates productization: Co specification, co validation, co design, and long term supply chain alignment establish higher entry barriers and delivery certainty. Industry Background: Copper Electrical Interconnects Reaching Their Limits With "computing power as national strength" and sovereign AI becoming key national strategic priorities, the world is accelerating investment in AI computing infrastructure. Network bandwidth demand is growing almost exponentially, rapidly moving from 400G toward 800G, 1.6T, and beyond. Traditional copper electrical interconnects face insurmountable physical limitations in bandwidth density, transmission distance, power consumption, and heat dissipation, and have become the core bottleneck for system scalability and energy efficiency improvement. As high end GPU single chip power consumption continues to rise, interconnect energy consumption and thermal load issues become even more prominent. Optical interconnect is no longer an option but a fundamental infrastructure requirement.   Figure 2: AI computing center networking architecture (Source: Acta Optica Sinica, 2025, Fig.10)   Architecture Trend: Silicon Photonics + CPO Become the Inevitable Evolution Path The industry widely recognizes Silicon Photonics and CPO as the direction for next generation architecture evolution. By bringing optical engines closer to – or even directly integrating them with – computing/switching chips, CPO can significantly reduce interconnect power loss, thermal load, and system complexity, while improving bandwidth density and overall energy efficiency.   Erised’s Strategy: Entering CPO with "Manufacturable System Engineering" to Shorten Time to Market and Enhance Delivery Certainty The capabilities Erised has accumulated over the long term in the Micro LED field are not limited to chip design, but also encompass "manufacturable system engineering" – including high density I/O, package integration, thermal management, process window control, reliability verification, and test system development. These capabilities heavily overlap with the key challenges of CPO, enabling Erised to transfer its existing methodologies to high speed optical interconnect architectures, shorten the cycle from engineering samples to commercial adoption, and improve delivery certainty. Erised Semiconductor stated: "We adhere to the core principle of 'verifiable, manufacturable, and deliverable' in our CPO strategy. Through system level integration and global partner collaboration, we aim to accelerate the productization and deployment of the next generation high speed optoelectronic integration platform, building long term competitiveness."   System Level Platform Layout: Full Coverage of Electronic ICs, Photonic ICs, 3D Packaging, CPO Architecture, and Thermal Management On the technology roadmap, Erised Semiconductor adopts a system level silicon photonics approach, comprehensively covering electronic ICs, photonic ICs, advanced 3D packaging, CPO architecture, and thermal management technologies. With a highly integrated platform, it provides a sustainable and scalable technology roadmap: capable of supporting current multi terabit data transmission needs, while also evolving to future scales of over hundreds of terabits per second, corresponding to the long cycle, deep level structural transformations of AI infrastructure. Figure 3: System level platform layout of EIC, PIC, and 3D packaging (Source: ASE official blog)   Ecosystem Collaboration: Co spec / Co validation / Co design, and L
Erised
2026-08-05

Erised Semiconductor's "Key Technologies for AMOLED Display Driver Chips" passed the scientific and technological achievement registration with the Ministry of Industry and Information Technology

On June 24, 2026, Erised Semiconductor (Shenzhen) Co., Ltd. completed the registration of scientific and technological achievements with the Ministry of Industry and Information Technology (MIIT) for its Research and Application of Key Technologies for AMOLED Display Driver Chips, with registration certificate No. 3392026Y0668. The registration authority was the China Academy of Information and Communications Technology (CAICT). On the same day, the joint laboratory of Erised Semiconductor and the Department of Electronic and Electrical Engineering at Southern University of Science and Technology (SUSTech) was inaugurated in Shenzhen, marking another step in industry university research collaborative innovation. These two milestones falling on the same day signify that this semiconductor enterprise rooted in Qianhai, Shenzhen, has gained nationally recognized authority for its technological strength in AMOLED display driver chips.   Seven Years of Deep Cultivation: From Chasing to Running Side by Side Founded in August 2018 and headquartered in the Qianhai Shenzhen Hong Kong Cooperation Zone, Erised Semiconductor is a national high tech enterprise. The company focuses on the R&D and sales of display driver chips, power management chips, and motor driver chips. Its core team comes from leading international semiconductor companies and holds dozens of domestic patents. In the display driver field, Erised has achieved a complete domestic product line layout. Its panel partners include industry leaders such as BOE and Truly, and its end products are supplied to well known domestic and international brands including TCL and Amazon. From TFT LCD to AMOLED and even Micro LED, Erised’s product portfolio covers the full spectrum of display technologies. The Key Technologies for AMOLED Display Driver Chips, which received this scientific and technological achievement registration, embodies the company’s years of R&D investment in this field. In March 2021, the AMOLED driver chip ER76288 for wearable applications entered mass production. In March 2024, Erised launched a new generation AMOLED driver chip for smartphones, ER66638, which adopts self developed display related algorithms including Demura, IRC, CTC, and other core technologies, effectively improving display quality and yield while reducing power consumption and cost. This IC flexibly switches functions in SRAM usage and is the smallest form factor solution in the industry that supports command mode, enabling seamless integration with different APs and panel manufacturers. In October 2025, it released the ER75138 – an AMOLED driver chip for smart bands and e cigarettes – further advancing the domestic substitution process in this field.   A Key Piece in the Domestic Substitution Puzzle AMOLED display technology, with its advantages of ultra thinness, high brightness, low power consumption, and high contrast, has become the preferred display solution for mobile devices such as smartphones, tablets, and smartwatches. The share of AMOLED in global mobile phone sales has already exceeded half and is expected to surpass 60% by 2026. Sales of AMOLED display driver chips in mainland China grew from 180 million units in 2020 to 478 million units in 2024, with a compound annual growth rate of 27.6%, and the global share rose from 24.9% to 37.0%. However, in this rapidly growing market, AMOLED driver ICs have long been dominated by overseas suppliers such as Samsung and Novatek, with insufficient support for refurbished and renewed market devices. Erised’s AMOLED driver chips were born precisely to fill this market gap. To date, they have been validated by several leading panel manufacturers on displays ranging from 0.74 to 6.9 inches and have already entered mass production and shipment. Passing the MIIT scientific and technological achievement registration means that the advancement, maturity, and application value of this technology have been officially confirmed at the national level. The registration is not only an important supporting document for national management of scientific achievements and recommendation for science and technology awards, but also helps gain recognition from investors and partners, serving as a key criterion for evaluating the value of the achievement.   Integrating Industry, Academia, and Research to Deploy Next Generation Display Technologies On the same day as the achievement registration, the joint laboratory of Erised Semiconductor and the Department of Electronic and Electrical Engineering at SUSTech was officially inaugurated. Leveraging Erised’s production platform and SUSTech’s research strengths, the joint laboratory will be built into an innovation platform that integrates research facility construction, industrial technology R&D and integration, talent cultivation, application demonstrations, and commercialization of results. At the unveiling ceremony, Erised’s chairman, Aliex, stated that the domestic semico
CPO
2026-08-04

CPO Moves from Concept to Mass Production, Ushering in a New Era of Optical Interconnection

"When glass substrates meet optical engines, and precision power management enables silicon photonic chips—in 2026, we officially announce our entry into CPO. This is not just an expansion of our business territory, but a strategic convergence rooted in common underlying technologies." Historic Inflection Point: CPO Moves from Concept to Mass Production In July 2026, the optical communications industry finally heard the long-awaited "starting gun." NVIDIA began shipping its next-generation Spectrum-X CPO switches to select partners, while Broadcom's 51.2T Bailly CPO switches continued small volume production—Co Packaged Optics (CPO) technology has officially transitioned from laboratory verification to commercial mass production. This is not only a victory for the technical roadmap, but also heralds the start of an entirely new industry cycle.   What is CPO and Why Does It Become an Industry Focus? In essence, CPO moves the optical module (optical engine) from the outer face of the switch into its heart, packaging it together with the ASIC switching chip. The optical engine, optical chips, and switching ASIC are all packaged on the same substrate, reducing the optical electrical interconnection distance to less than 1 cm and achieving industry best signal loss levels. Compared with traditional pluggable optical modules, CPO offers outstanding advantages. In conventional solutions, electrical signals must travel long distances across the circuit board, and as speeds exceed 1.6 Tbps they approach physical limits. CPO shortens the electrical signal transmission distance from centimeters to millimeters, dramatically reducing power consumption and latency. For example, Broadcom's 51.2T Bailly CPO switch reduces power consumption by about 70% compared with traditional pluggable optical modules. Schematic diagram of Co Packaged Optics (CPO) technology (Image source: Sina Finance)   Two Flagship Products Land, Ushering in the Mass Production  The two current landmark CPO products have both entered mass production: NVIDIA Spectrum X CPO switch, developed by NVIDIA in collaboration with TSMC using the COUPE advanced packaging process, delivers a total switching capacity of 400 Tb/s, with production capacity expected to expand further in the second half of 2026. Broadcom 51.2T Bailly CPO switch, brought to mass production with assistance from Delta Electronics and Micas Networks, has completed deployment verification by hyperscale cloud providers such as Meta, with preliminary confirmation of feasibility in real world data center environments. The successive launch of these two flagship products marks the formal transition of CPO from technology validation to scaled commercialization. NVIDIA Spectrum X CPO Switch (Image source: Apple Daily News)   Market Outlook: A Multi Billion Dollar Blue Ocean Accelerates Several authoritative institutions have issued highly optimistic forecasts for the CPO market: Yole Group's July 2026 report "Data Center Co packaged Optics 2026" states that CPO has moved from concept to commercial reality, with development speed and scale far exceeding 2023 expectations. Global CPO optical engine revenue will grow at a CAGR of approximately 228% from 2026 to 2031, reaching US$112 billion by 2031. Light Counting projects that the AI driven optical transceiver and CPO market will reach US$16.5 billion in 2025 and surge to US$26 billion in 2026, an annual growth rate of 60%. Trend Force forecasts that CPO penetration will rise from about 0.55% in 2026 to about 8% in 2028, corresponding to a market size of approximately US$3.3 billion. Other data show that the global CPO market will reach US$2 billion in 2026, up more than 400% year on year; the Chinese market will exceed RMB 10 billion, with growth surpassing 500%. Goldman Sachs, in its latest research report, raised its forecast for the global optical module market, projecting US$50.9 billion in 2026 and US$72.6 billion in 2027. The Yole report specifically notes that Scale Up is the "killer application" for CPO—copper interconnects have reached physical limits under the trend of doubling bandwidth, making CPO the only viable path to achieving larger scale GPU clusters. Scale Up switch optical engines and compute optical engines together account for about 94% of the market, representing the largest revenue source. Image source: Yole Group, "Data Center Co packaged Optics 2026"   Three Major Bottlenecks: Mass Production Is Only the Beginning Mass production does not mean supply bottlenecks are eliminated. TrendForce notes that the CPO switch supply chain faces three core constraints: First, the optical engine segment. Optical engines require the integration of lasers, modulators, and many other components, with complex processes and extremely high yield requirements, compounded by thermal management challenges. Only a few suppliers currently have mass‑production capabilities. Second, silicon photonics capac
Erised
2026-06-29

Erised – SUSTech Department of Electronic and Electrical Engineering Joint Laboratory Inaugurated

On the morning of June 24, 2026, Erised (Shenzhen) Co., Ltd. and the Department of Electronic and Electrical Engineering at Southern University of Science and Technology (SUSTech) jointly inaugurated the “SUSTech Department of Electronic and Electrical Engineering – Erised Joint Laboratory” in Conference Room 812 of the College of Engineering.  Attending the ceremony were Erised’s Chairman Chen Tingyang, General Manager of the Display Driver Business Group Xie Yuxuan, and other core members of the company. From SUSTech, Professor Chen Mingwei, Dean of the College of Engineering, Associate Professors Jiang Junmin and Hua Mengyuan, Research Assistant Professor Hu Chen from the Department of Electronic and Electrical Engineering, as well as Associate Professor Gao Yuan from the School of Microelectronics, along with faculty and student representatives, gathered to witness this important moment.   At the start of the unveiling ceremony, Professor Chen Mingwei, Dean of SUSTech’s College of Engineering, delivered the first address and extended a warm welcome to Chairman Chen Tingyang and his delegation. He noted that the College of Engineering has developed rapidly in the field of information semiconductors, thanks to university industry collaboration and support from the Shenzhen municipal government. In recent years, the College has performed exceptionally well in research funding, with nearly one third of its annual research budget coming from the semiconductor and information industries. He emphasized that the semiconductor industry is currently experiencing an AI driven super cycle expansion, with an upward trend spanning the entire industrial chain—from chips, memory, and optoelectronics to AI automation. This technological boom provides a strategic window for enterprise university cooperation. The College will support the joint laboratory in terms of policy and value creation, and hopes that both sides will build a mutually beneficial mechanism for integrating production, education, research, and application. Through collaborative research, they aim to solve key technological issues in emerging industries, actively encourage students to undertake internships and practical training in the company, and cultivate students’ practical innovation capabilities through teaching cooperation. [Speech by Dean Chen Mingwei] Chairman Chen Tingyang shared Erised’s growth journey in his speech. Over the past seven years, Erised has been deeply engaged in the chip sector, focusing on R&D in display drivers, power management, and optical interconnect ICs. The company’s core R&D team comes from leading semiconductor companies in the industry, possessing solid know how in industrialization. He remarked that China’s semiconductor industry stands at a critical turning point from technology introduction to independent innovation, and that the deep coupling of industrial upgrade demands with university research strengths will be a key path to breaking through core technology bottlenecks. Erised has long valued university industry partnerships, and the company is full of anticipation for this collaboration with SUSTech. In the future, the joint laboratory will serve as an important vehicle to fully integrate the company’s industrial platform with the university’s research resources, deeply connecting the entire chain of production, education, research, and application, so that both parties can complement each other’s strengths and achieve mutual progress. [Speech by Chairman Chen Tingyang] Mr. Xie Yuxuan, General Manager of the Display Driver Business Group, gave a comprehensive presentation on Erised’s overall development strategy and core product lines to the university leaders, faculty, and students. He explained that the company currently focuses on two major chip tracks: display drivers and power management. In the display driver field, Erised has completed the full deployment of a domestic product line, which constitutes its differentiated core competitiveness. Its panel partners include industry leaders such as BOE and Truly, and its end products supply well known domestic and international brands including TCL and Amazon. The power management business has also undergone a strategic upgrade, combining sustained independent R&D with expanded industrial investment, and collaborating with multiple partners to jointly develop power ICs for small electric devices. He expressed the hope that, through the newly established joint laboratory, the company can engage in deeper, more targeted collaborative research with the SUSTech team。 [Speech by General Manager Xie Yuxuan] Subsequently, Chairman Chen Tingyang and Dean Chen Mingwei jointly unveiled the plaque for the joint laboratory. [Unveiling ceremony]  Following the unveiling, Associate Professor Jiang Junmin from SUSTech’s Department of Electronic and Electrical Engineering, who serves as the Director of the joint laboratory, presented the 2026 2027 construc
Honor
2026-05-09

Honor Crowned! Erised Semiconductor Wins "Guangdong-Hong Kong-Macao Greater Bay Area Strategic Emerging Industry Pilot Enterprise" Award

Under the theme "Innovation · Co-construction of the Chain", the NEX WAVE 2026 Greater Bay Area Strategic Emerging Industries and Future Industries Ecosystem Connectivity Conference was recently held with great ceremony in Shenzhen. The conference was co-hosted by the Guangdong-Hong Kong-Macao Greater Bay Area Strategic Emerging Industries Development Promotion Association and the Shenzhen Strategic Emerging Industries Development Promotion Association. More than 500 elites from government, industry, academia, research, finance and other fields gathered to discuss the development of new quality productive forces and industrial ecosystem collaboration. At the conference, Erised Semiconductor (Shenzhen) Co., Ltd., by virtue of its outstanding independent innovation capability and industrial leadership, was awarded the "2025 Guangdong-Hong Kong-Macao Greater Bay Area Strategic Emerging Industry Pilot Enterprise" title jointly issued by the Guangdong-Hong Kong-Macao Greater Bay Area Strategic Emerging Industries Development Promotion Association and the Shenzhen Strategic Emerging Industries Development Promotion Association! It is reported that this selection campaign officially opened for registration in May 2025 and lasted a total of 8 months. Through steps including "press release, registration, preliminary material review, on-site research, and expert comprehensive evaluation", comprehensive assessments were made across multiple areas such as scientific research, venture capital, industry, and corporate services. In the end, 50 enterprises were selected for the "Pilot Enterprise" list, of which 56% are national-level "Little Giant" specialized and sophisticated enterprises, holding a total of over 17,000 patents. This research is a comprehensive benchmark project initiated by the Strategic Emerging Industries Development Promotion Association in conjunction with several authoritative institutions. It has been held for five consecutive years, cumulatively releasing 250 pilot enterprises, 48 pioneering figures, and 100 young leaders, forming the most influential benchmark ecosystem for strategic emerging industries in the Greater Bay Area. In such a rigorous and authoritative selection, Erised Semiconductor broke through forcefully and, with its outstanding independent innovation capability and industry leadership, was honored on the "Pilot Enterprise" list, adding yet another authoritative accolade in the field of strategic emerging industries. From High-tech Enterprise to Specialized and Sophisticated "Little Giant", and then to Shenzhen Gazelle Enterprise, and now the Greater Bay Area Strategic Emerging Industry "Pilot Enterprise" — every step of Erised Semiconductor's growth has been inseparable from its persistent dedication to technological innovation, and even more so from the trust and support of every customer, partner, and employee. In the future, we will continue to move forward with this honor, contributing irreplaceable "Erised Power" to the high-quality development of the semiconductor industry in the Greater Bay Area with even stronger innovation!
Great
2025-07-24

Great News! Erised Semiconductor Co., Ltd. Awarded Shenzhen "Gazelle Enterprise" Title: A Powerful Boost for Innovation!

 At the highly anticipated "2025 China (Shenzhen) Unicorn Enterprise Conference," Erised Semiconductor Co., Ltd. was honored with the prestigious title of "Shenzhen Gazelle Enterprise," thanks to its outstanding technological innovation capabilities and remarkable high-growth performance. This significant recognition not only fully affirms Erised Semiconductor's development potential but also marks a new starting point for the company to achieve even higher goals.......
Erised
2024-04-15

Erised Semiconductor was awarded the "2023 Excellent Domestic Brand Enterprise Growth Star in the Electronic Components Industry" by Huaqiang Electronics Network as a High Quality Supplier

On April 12, 2024, the "2024 Semiconductor Industry Development Trends Conference and the 2023 (16th) Huaqiang Electronics Network High Quality Suppliers&Excellent Domestic Brands in the Electronic Components Industry Award Ceremony" hosted by Huaqiang Electronics Network successfully concluded at the Intercontinental Hotel in Nanshan, Shenzhen......
Erised
2024-04-07

Erised Semiconductor won the "Market Performance Award" at the Shenzhen Integrated Circuit Industry Summary Conference

In addition, at this conference, the Shenzhen Semiconductor Industry Association also presented ten categories of awards based on the achievements and industry contributions of enterprises and individuals. Erised Semiconductor won the "Market Performance Award" for its outstanding performance...
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From Electricity to Light, We Redefine "Driving" News 丨 2026-08-12 丨
Six months ago, when CPO was still on the eve of mass production at scale, we did one thing: we announced our full scale entry into CPO. Half a year later, NVIDIA's Spectrum X CPO switches have started shipping to partners, and Broadcom's 51.2T Bailly CPO switches are maintaining small volume production. CPO has officially moved from proof of concept into the commercial mass production phase. Looking back, that decision was not impulsive. It was not only a strategic choice to align with the generational shift in AI computing infrastructure, but also a critical leap that transforms our deep expertise in display drivers and power management into a core competitive edge in next generation optoelectronic integration. As a company that started with display drivers and power management, our move into CPO is by no means blind diversification; it is grounded in the commonality of underlying technologies: Core Positioning in Power Management: CPO modules integrate optical engines and switching chips with high density, imposing extreme demands on local power supply stability, transient response, and energy efficiency. Our deep accumulation in power management ICs (PMICs) is now being transformed into high density power modules and laser driver chips (LDDs) for CPO optical engines, delivering customized, high precision, low noise power solutions. Synergy of Precision Driving: Our accumulated expertise in precision signal control and packaging processes from display drivers aligns exceptionally well with the precision driving requirements for lasers and modulators in CPO optical engines. This capability is now extending to critical components on the receiving end, such as trans impedance amplifiers (TIAs) and optical modulator driver chips, covering the entire optical signal transmission and reception chain. Embracing Next Generation Technology Evolution: In addition to the mainstream silicon photonics route, we are also actively evaluating emerging technology paths such as Micro LED optical communication. These new technologies pose entirely fresh demands on driving and power, which are precisely the ideal battleground for us to leverage our dual genetic strengths in display drivers and power management. The year 2026 marks the first year of CPO mass production and also our starting year on the optoelectronic integration track. Leveraging our core technological accumulations in Micro LED device driving, optoelectronic calibration, and mass transfer defect compensation, we are extending our dual genetic advantages in display drivers and power management into the field of Micro LED high speed optical interconnects for AI data centers. To date, the company has accumulated over 70 patents, shipped more than 200 million chips in total, and served over 100 clients worldwide. Behind these numbers lies our complete capability loop from R&D to mass production, from validation to delivery, in display drivers and power management. It is precisely this capability that emboldened us to make the strategic decision to fully enter CPO when it was still on the eve of large scale mass production. Looking ahead, we will continue to uphold our core principle of "verifiable, mass producible, and deliverable," striving for excellence in our foundational businesses of power and driving. We will keep increasing R&D investment, collaborate with upstream and downstream partners across the industrial chain, and jointly build a prosperous and healthy semiconductor ecosystem, contributing unique value to the CPO ecosystem. From screens to optical engines, from Micro LED to CPO—we are already on board the vast ocean of optoelectronic integration.   Media Contact: Tel: 0755-26671807 Sales Email: sales@erised-semi.com Website: www.erised-semi.com    

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