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Product Shelf Life

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Information

After delivery to the customer, the shelf life of semiconductor products depends on various factors, including the type of material used in the device, manufacturing conditions, moisture sensitivity level (MSL), whether moisture-proof bags (MBB) are used for product packaging, the amount of desiccant used, and the customer's storage conditions. ERISED strictly controls its internal manufacturing and storage processes to provide products with appropriate customer shelf-life performance.

 

ERISED product storage

We encourage customers to consider this detailed information when managing and evaluating the storage and lifecycle of ERISED products.

 

The minimum service life of ERISED products is calculated from the date of delivery to the customer, not from the date of manufacture.

 

ERISED conducts extensive long-term reliability research to confirm its internal manufacturing shelf-life policy. The electrical characteristics of ERISED's products have not deteriorated after long-term storage, and there are no product failures related to ERISED's internal manufacturing and storage practices. In addition, ERISED's product distribution center will take specific measures to ensure that all materials are intact before shipment.

Due to advances in technology, materials, manufacturing methods, and logistics, ERISED's manufacturing date code will not affect the use, quality, or reliability of the product. 

In summary, the shortest service life and ERISED warranty period of ERISED products are calculated from the delivery of the product to the customer.

 

Shelf life of customer products

How customers store ERISED products is crucial. The shelf life of customer products refers to the length of time that customers can store products correctly after delivery. The way customers store and handle ERISED products is crucial to ensuring that the products meet the expected customer shelf life. Please refer to the MSL information on the ERISED product package or packaging box for instructions on the allowable duration of environmental exposure. Please note that some products are sensitive to humidity and therefore require MBB packaging. We use dedicated MBB and a certain amount of desiccant for storage within this MBB. ERISED MBB also includes a humidity indicator card (HIC) to ensure that product storage is not affected. If the HIC displays pink and the humidity level is>10%, the components in the MBB need to be baked before use.

Please note that some products are sensitive to humidity and therefore need to be packed in Moisture Barrier Bags (MBB). We use a dedicated MBB and a certain amount of desiccant for storage inside this MBB. A Humidity Indicator Card (HIC) is also included in the ERISED MBB to ensure unaffected product storage. If the HIC shows pink and the humidity level is >10%, the parts in this MBB need to be baked before use.

 

ERISED's policies and practices help ensure the quality, reliability, and continuity of supply. Establish, manage, and preserve inventory in a way that helps ensure supply continuity, in order to achieve more immediate product supply and minimize the burden caused by production restrictions and the discontinuation of mature products.

From Electricity to Light, We Redefine "Driving" News 丨 2026-08-12
Six months ago, when CPO was still on the eve of mass production at scale, we did one thing: we announced our full scale entry into CPO. Half a year later, NVIDIA's Spectrum X CPO switches have started shipping to partners, and Broadcom's 51.2T Bailly CPO switches are maintaining small volume production. CPO has officially moved from proof of concept into the commercial mass production phase. Looking back, that decision was not impulsive. It was not only a strategic choice to align with the generational shift in AI computing infrastructure, but also a critical leap that transforms our deep expertise in display drivers and power management into a core competitive edge in next generation optoelectronic integration. As a company that started with display drivers and power management, our move into CPO is by no means blind diversification; it is grounded in the commonality of underlying technologies: Core Positioning in Power Management: CPO modules integrate optical engines and switching chips with high density, imposing extreme demands on local power supply stability, transient response, and energy efficiency. Our deep accumulation in power management ICs (PMICs) is now being transformed into high density power modules and laser driver chips (LDDs) for CPO optical engines, delivering customized, high precision, low noise power solutions. Synergy of Precision Driving: Our accumulated expertise in precision signal control and packaging processes from display drivers aligns exceptionally well with the precision driving requirements for lasers and modulators in CPO optical engines. This capability is now extending to critical components on the receiving end, such as trans impedance amplifiers (TIAs) and optical modulator driver chips, covering the entire optical signal transmission and reception chain. Embracing Next Generation Technology Evolution: In addition to the mainstream silicon photonics route, we are also actively evaluating emerging technology paths such as Micro LED optical communication. These new technologies pose entirely fresh demands on driving and power, which are precisely the ideal battleground for us to leverage our dual genetic strengths in display drivers and power management. The year 2026 marks the first year of CPO mass production and also our starting year on the optoelectronic integration track. Leveraging our core technological accumulations in Micro LED device driving, optoelectronic calibration, and mass transfer defect compensation, we are extending our dual genetic advantages in display drivers and power management into the field of Micro LED high speed optical interconnects for AI data centers. To date, the company has accumulated over 70 patents, shipped more than 200 million chips in total, and served over 100 clients worldwide. Behind these numbers lies our complete capability loop from R&D to mass production, from validation to delivery, in display drivers and power management. It is precisely this capability that emboldened us to make the strategic decision to fully enter CPO when it was still on the eve of large scale mass production. Looking ahead, we will continue to uphold our core principle of "verifiable, mass producible, and deliverable," striving for excellence in our foundational businesses of power and driving. We will keep increasing R&D investment, collaborate with upstream and downstream partners across the industrial chain, and jointly build a prosperous and healthy semiconductor ecosystem, contributing unique value to the CPO ecosystem. From screens to optical engines, from Micro LED to CPO—we are already on board the vast ocean of optoelectronic integration.   Media Contact: Tel: 0755-26671807 Sales Email: sales@erised-semi.com Website: www.erised-semi.com    

Provide A Comprehensive Solution for Display and Power supply.

Erised Semiconductor, is a fabless IC design company with owned intellectual property, mainly engaged in chip research and development, design, manufacturing, testing and sales, providing customers with reliable and comprehensive solutions.

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